MediaTek To Announced Its First 5G Chip Helio M70 Soon

Today, on December 6, Qualcomm held the Snapdragon Technology Summit in Hawaii and officially launched the Snapdragon 855 mobile platform. It is based on the 7nm process and is equipped with the fourth-generation multi-core AI Engine. Compared with the previous generation, it has improved the performance in at least four aspects – the overall performance, artificial intelligence performance, photography, and network connectivity. Especially, we should focus on the 5G which is enhanced a lot due to the Snapdragon X50 5G modem. At the same time, the manufacturer announced that 5G terminals will be unveiled in the first half of 2019. However, another big chip maker MediaTek also announced through the official Weibo channel that its first 5G multi-mode integrated baseband chip Helio M70 will be unleashed in Guangzhou and is expected to be available in the first half of 2019 as well.

The MediaTek Helio M70 is an independent 5G baseband chip based on TSMC’s 7nm process. It has further improved heat control, enabling faster connection speed, lower power consumption, and better reference design to create a high-speed network experience in the 5G era.

The Helio M70 is designed in accordance with 3GPP Rel-15 5G new air interface standards, including support for stand-alone (SA) and non-independent (NSA) network architectures, supporting Sub-6GHz bands, high power terminals (HPUE) and other 5G key technologies. In addition to the Sub-6GHz band, MediaTek’s 5G solution will also support the millimeter wave band to meet the needs of different operators.

At last, MediaTek CEO Cai Lixing also said that the company is developing its own 5G system-on-a-chip (SoC), which is expected to be available by the end of this year.